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1 pah8011et product datasheet low power optical heart rate monitor chip pixart imaging inc. pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without per mission. version 1.1 | 22 sep. 2017 | 31009 a en pah8011et: low power optical heart rate monitor chip general description the pah8011et is a low power cmos - process optical heart rate monitor chip with integrated dsp that is packaged together with three chip - on - board leds: two green and one infrared int o a single package supporting heart rate detection (hrd) function . it is based on optical sensing technology that captures higher resolution image than the traditional photodiode. the images are then processed through the integrated dsp to attain processed ppg (photoplethysmogram) data for use in deducing heart rate. key features ? support heart rate detection function ? sram buffer support ? integrated ultra - low power mode, while in power - down mode ? hardware power - down support ? invisible light for touch detectio n function ? optical coating resistance ambient light ? integrated chip - on - board leds with wavelength of 525nm and 940nm ? communication interface options ? i 2 c ? four - wire spi ? i 2 c interface up to 1 mbit/s ? spi interface up to 10 mbit/s applications ? heart rate monit or accessories ? wearables: smartwatch, wrist band key parameters parameter value operating temperature, tj - 35 to +80 c system clock 4 m hz supply voltage vddm: 3. 1 C 3.6 v * vddled: 3.3 C 4.5 v vddio: 1.62 C 3.6 v vdda/vddd: 1.7 C 1.9 v analog: 1.8 v digital: 1.8 v power consumption @ 3.3v note: including led current, without i/o toggling active: printing cover: 90 a double injection + wall cover : 180 a ir touch detection: 15 a power - down: 1 a heart rate measurement range 30 - 240 bpm package size 3.6 x 6.36 x 1.0 mm * refer to section 9 .16 supply voltage registers ordering information part number package type pah8011et - ip 21 - pin lga for any additional inquiries, please contact us at ht tp://www.pixart.com/contact.asp *disclaimer: the pah8 011 et - ip is not designed for usage in medical device. in addition, the data and information of heart rate measurement provided by this chip may not be completely accurate and may exceed heart rate tol erance as per the specification stated in the document due to different factors, such as interference with signal from external sources, incorrect wearing position and changes in weather conditions or user s body condition. pixart imaging inc. disclaims a ll liability arising from such inaccuracy and assumes no responsibility for the consequences of use of such data and information.
2 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. c ontents pah8011et: low power optical heart rate monitor chip ................................ ................................ ................................ ....... 1 general description ................................ ................................ ................................ ................................ ............................ 1 key features ................................ ................................ ................................ ................................ ................................ ....... 1 applications ................................ ................................ ................................ ................................ ................................ ........ 1 key parameters ................................ ................................ ................................ ................................ ................................ ... 1 ordering in formation ................................ ................................ ................................ ................................ .......................... 1 contents ................................ ................................ ................................ ................................ ................................ .................. 2 list of figures ................................ ................................ ................................ ................................ ................................ ........... 3 list of tables ................................ ................................ ................................ ................................ ................................ ............ 3 1.0 introduction ................................ ................................ ................................ ................................ ................................ . 4 1.1 overview ................................ ................................ ................................ ................................ ................................ . 4 1.2 terminology ................................ ................................ ................................ ................................ ............................ 4 1.3 signal description ................................ ................................ ................................ ................................ .................... 5 2.0 operating specifications ................................ ................................ ................................ ................................ .............. 6 2.1 absolute maximum ratings ................................ ................................ ................................ ................................ ..... 6 2.2 recommended operating conditions ................................ ................................ ................................ ..................... 6 2.3 thermal speci fications ................................ ................................ ................................ ................................ ............ 7 2.4 dc characteristics ................................ ................................ ................................ ................................ .................... 7 2.5 ac characteristics ................................ ................................ ................................ ................................ .................... 8 3.0 mechanical specifications ................................ ................................ ................................ ................................ ............ 9 3.1 mechanical dimension ................................ ................................ ................................ ................................ ............ 9 3.2 package marking ................................ ................................ ................................ ................................ ................... 10 4.0 system level description ................................ ................................ ................................ ................................ ........... 11 4.1 system overview ................................ ................................ ................................ ................................ ................... 11 4.2 heart rate detection ................................ ................................ ................................ ................................ ............. 12 4.3 reference schematic ................................ ................................ ................................ ................................ ............. 14 4.4 design guidelines ................................ ................................ ................................ ................................ .................. 15 4.5 recommend guideline for pcb assembly ................................ ................................ ................................ ............. 17 4.6 packaging information ................................ ................................ ................................ ................................ ........... 18 5.0 registers list ................................ ................................ ................................ ................................ .............................. 20
3 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. list of figures figure 1 . functional block diagram ................................ ................................ ................................ ................................ ......... 4 figure 2 . pin configuration ................................ ................................ ................................ ................................ ...................... 5 figure 3 . package outline diagram ................................ ................................ ................................ ................................ .......... 9 figure 4 . package marking ................................ ................................ ................................ ................................ ..................... 10 figure 5 . system design for app level ................................ ................................ ................................ ................................ ... 11 figure 6 . system design for firmware level ................................ ................................ ................................ .......................... 12 figure 7 . reference application circuit ................................ ................................ ................................ ................................ .. 14 figure 8 . recommended pcb layout ................................ ................................ ................................ ................................ ..... 15 figur e 9 . pcb layout guide ................................ ................................ ................................ ................................ ................... 16 figure 10 . ir reflow soldering profile ................................ ................................ ................................ ................................ .... 17 figure 11 . carrier drawing ................................ ................................ ................................ ................................ ..................... 18 figure 12 . unit orientation ................................ ................................ ................................ ................................ .................... 19 list of tables table 1 . signal pins description ................................ ................................ ................................ ................................ ............... 5 table 2 . absolute maximum ratings ................................ ................................ ................................ ................................ ........ 6 table 3 . recommended operating conditions ................................ ................................ ................................ ........................ 6 table 4 . th ermal specifications ................................ ................................ ................................ ................................ ............... 7 table 5 . dc electrical specifications ................................ ................................ ................................ ................................ ........ 7 table 6 . ac electrical specifications ................................ ................................ ................................ ................................ ......... 8 table 7. register bank0 ................................ ................................ ................................ ................................ .......................... 20 table 8. register bank1 ................................ ................................ ................................ ................................ .......................... 21 table 9. register bank2 ................................ ................................ ................................ ................................ .......................... 22 table 10 . register bank4 ................................ ................................ ................................ ................................ ........................ 22
4 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 1.0 introduction 1.1 overview the pah8011et a low power and good performance optical heart rate monitor chip . it is integrated with dsp and built - in with 2 green leds, 1 infrared led in a single package . it comes with two communication interfaces, which are i 2 c supporting up to 1 mbit/s and four - wire spi supporting up to 10 mbit/s. the sram buffer of 1596 bytes is supported for the power saving at the host. the figure 1 shows the architecture block diagram of the device. refer to the subsequent chapters for detailed information on the functionality of the different interface blocks. note: thro ughout this document pah8011et low p owe r optical heart rate monitor chip is referred to as the pa h 8011et . figure 1 . functional block diagram 1.2 terminology term description gnd ground bidir bi - directional ppg photoplethysmogram touch touch detection for wear on or wear off array timing g enerator pga + adc led d river g / g / ir signal p rocess sram fifo buffer channel clock g enerator lo speed rc 32 khz hi speed rc 4 mhz power regulator output vdday : 2 . 8 v input vddm : 3 . 1 - 3 . 6 v vddled : 3 . 3 - 4 . 5 v vdda / vddd : 1 . 7 - 1 . 9 v vddio : 1 . 62 - 3 . 6 v int 1 i 2 c spi ch _ a pah 80 11 et led 1 led 2 powerdn led 0 vdda y vdda / vddd vddled vddio spi _ s clk _ i 2 c _ scl spi _ csn spi _ sdo spi _ i 2 c i / o i nterface s spi _ sdi _ i 2 c _ sda vddm int 2 vssa vssd vssled p o w e r g n d serial interface t e s t int 1 powerdn int 2 ch _ b ch _ c ch _ t
5 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 1.3 signal description figure 2 . pin configuration table 1 . signal pins description pin no. signal name type description functional group: power supplies 3 vddio input i/o power supply (1.62 - 3.6v) 5 vssa gnd analog ground 6 vdday output internal regulator output. must connect 0.1f capacitor to gnd 7 vssled gnd led ground 8 vddm input analog main power supply (3. 1 - 3.6v) for internal power regulator 9 vdd_led01 input ir/green led anode. provide vddm supply vo ltage or power supply (3.3 C C 2 c: clock 2 spi_sdi_i2c_sda bidir 4 - wire spi: data input i 2 c: data input - output 16 spi_sdo output 4 - wire spi: data output. connect to gnd when i 2 c interface 17 spi_csn input 4 - wire spi: chip select. active low . connect to gnd when i 2 c interface functional group: functional i/o 4 int1 output data ready interrupt. default is edge sensitive interrupt, can be changed to level sensitive interrupt (high active) in int_type register 13 spi_i2c input interface selection i 2 c: pull down (tie to gnd) 4 - wire spi: pull high (tie to vddio) 14 int2 output touch interrupt. default is e dge sensitive interrupt, can be changed to level sensitive interrupt (high active) in int_type register 15 powerdn input hardware control to enter power down mode. connect to gnd when not used level high: enter power down mode level low: leave power down mode functional group: reserved 19 led2 rsv reserved for led2 test pin , is only used by probe 20 led1 rsv reserved for led1 test pin , is only used by probe 21 led0 rsv reserved for led0 test pin , is only used by probe
6 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 2.0 operating specifications 2.1 absolute maximum ratings table 2 . absolute maximum ratings parameters symbol min. max. unit notes analog voltage v ddm_max - 0.4 v ddm + 0.3 v i/o voltage v ddio_max - 0.4 v ddio + 0.3 v i/o pin input high voltage v ddio_in - 0.4 v ddio + 0.3 v all i/o pins relative humid ity rh 0 50 % non - condensing, non - biased esd esd hbm - 2 kv class 2 on all pins, as per human body model. jesd22 - a114e with 15 sec zap interval. notes: 1. at room temperature. 2. maximum ratings are those values beyond which damage to the device may occur. 3. ex posure to these conditions or conditions beyond those indicated may adversely affect device reliability. 4. functional operation under absolute maximum - rated conditions is not implied and should be restricted to the recommended operating conditions. 2.2 recommen ded operating conditions table 3 . recommended operating conditions description symbol min. typ. max. unit notes ambient temperature t a - 20 25 60 c operating junction temperature t j - 35 - 80 c power supply voltage v ddm 3. 1 3.3 3.6 v power regulator input supply. includes ripples led power supply voltage v ddled 3.3 - 4.5 v led power supply. includes ripples analog supply voltage v dda 1.7 1.8 1.9 v analog power supply. includes ripples digital supply voltage v ddd 1.7 1.8 1.9 v digital power supply. includes ripples i/o supply voltage v ddio 1.62 1.8 3.6 v includes ripples power regulator output voltage v dday 2.52 2.8 3.08 v internal regulator output. includes ripples supply noise v npp - - 100 mv p - p peak to peak within 10 k C 80 mhz serial clock frequency sck_spi - - 10 mhz sck_i 2 c - 400 1 1000 2 khz 1. max value for fast mode 2. max value for fast mode plus note: pixart does not guarantee the performance if the operating temperature is beyond the specified limit.
7 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 2.3 therma l specifications table 4 . thermal specifications parameters symbol min. typ. max. unit notes storage temperature t s - 40 - 125 c lead - free solder temperature t p - - 245 c refer to package handling information document 2.4 dc char acteristics table 5 . dc electrical specifications parameters symbol min. typ. max. unit conditions peak power supply current i ddm_max - - 10 ma for v ddm i ddled_max - - 150 ma for v ddled i ddd_max - - 20 ma for v ddd i dda_max - - 10 ma for v dda peak i/o supply current i ddio_max - - 30 ma for v ddio output supply current i dday_max - - 20 ma for v dday power consumption supply current @ power down i ddpd - 1 - a for chip only wakeup by read register with two green leds suppl y current @ hrd ppg mode i ddhrd - 65 - a for chip only, not including led current, without i 2 c interface i/o toggle led current i ddled - 2 5 - a 20 report/sec, led dac = 12 ma, on yellow skin color (et=11.5 us) with ir touch detection supply current @ t ouch detection mode i ddtouch 9 a for chip only, not including led current, without i 2 c interface i/o toggle led current at touch i ddled - 6 - a 8 report/sec, led dac = 50ma, on yellow skin color i/o input high voltage v ih 0.7* v ddio - - v input lo w voltage v il - - 0.3* v ddio v output high voltage v oh v ddio - 0.4 - v ddio + 0.4 v @i oh = 2ma output low voltage v ol - 0.4 - 0.4 v @i ol = 2ma led sink current i led 40 50 60 ma @ led dac = 50ma led cathode voltage v led - 0.4 3.6 v notes: 1. electrica l characteristics are defined under recommended operating conditions. 2. all the parameters are tested under operating conditions: v ddm = 3.3v, v ddio = 1.8 and 3.3v, t a = 25c
8 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 2.5 ac characteristics table 6 . ac electrical specifications p arameters symbol min. typ. max. unit conditions power up from v dd t pu - 10 - ms from v dd to valid interface communication sdi/sdo read hold time t hold - 3 - s minimum hold time for valid data. address and data delay time t delay 2.75 s refer to serial interface section chip pulse interrupt width t int 2 - 32 s default 32us, can be changed in int_pulse_width register rise and fall times: sdi/sdo t r , t f - 30 - ns c l = 30 pf hw powerdn time t powerdn 300 500 - s powerdn keep high period notes: 1. electrical characteristics are defined under recommended operati ng conditions 2. all the parameters are tested under operating conditions: t a = 25c, v ddm = 3.3v, v ddio = 3.3v for 3.3v io application and v ddio = 1.8 v for 1.8v io application.
9 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 3.0 mechanical specifications 3.1 mechanical dimension figure 3 . package outline diagram
10 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 3.2 package marking refer to figure 4 . for the code marking location on the device package. figure 4 . package marking
11 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.0 system level description 4.1 system overview this se ction describes on how the chip being used to make up a complete system including the explanation on the 3 rd party components and how they work with the chip . the pah8011 et is based on cmos optical technology that is designed to meet the requirements of he art rate monitor accessories and wearables like smart watch or wrist band device. figure 5 illustrates a system design for app level diagram. the p rocessor is accessing ppg data from pah 8011 et chip , then pass it to app lev el. app level applies pixart provided algorithm library to determine the heart rate data and wa veform. figure 6 . illustrates a system design for firmware level diagram. the processor will also access ppg d ata from pah 8011 et chip , then perform heart rate calculation with pixart algorithm library and send result to display or end device. pah8011et can be configured to generate different frame rate settings. figure 5 . system design f or app level
12 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. figure 6 . system design for firmware level 4.2 heart rate detection heart rate detection is an optical measurement technique that uses a light source and a detector to detect cardiovascular pulse wave that propagates t hrough the body. the detected signal (pulse wave) called photoplethysmography and it is known as ppg/ptg. the ppg signal reflects the blood movement in the vessel, which goes from the heart to the fingertips through the blood vessels in a wave - like motion. therefore, we can use this ppg signal to calculate heart rate. this optical based technology could offer significant benefits in healthcare application as it is noninvasive, yet accurate a nd simple to use. 4.2.1 applications ? heart rate detection in general h ealthcare (perfusion index : typ.1% ) ? ppg waveform
13 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.2.2 heart rate detection performance parameters value unit conditions heart rate measurement range 30 C 240 bpm heart rate tolerance of average root mean square (arms) 3 bpm @ room temperature for steady state: 0 km/hr. 5 bpm @ room temperature for motion state: 0 C 9 km/hr on the treadmill. response time 8 C 10 second @ heart rate = 72/bpm notes: ? pah8011et can provide heart rate measurement. however, it is not for medical device usage. ? for usage of heart rate detection chip on the wearable device that to be put on the wrist, finger or palm, ? the chip must be placed securely and in - contact with the skin surface as well as keeping it stable without any motion during measurement in acquiring accurate h eart rate measurement. ? do not wear the device on the wrist bone. it should be wear on the higher position of, especially for those with a smaller wrist. ? chip s performance is optimized with good blood flow. it is recommended to have light exercise for a f ew minutes to increase your blood flow before turning on the heart rate monitor. ? on cold weather condition or user is having poor blood circulation (e.g.: cold hands, fingers and feet), the chip performance (heart rate accuracy) could be effected as the b lood flow is slower in the measuring spot position. it is recommended to activate the heart rate monitor in indoor use. ? if the chip is having problem to read heart rate, may try to swap it on the other side of hand wrist to repeat the measurement. ? for cont inuous heart rate measurement, do minimize hand movement and extreme bending of the wrist.
14 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.3 reference schematic figure 7 . reference application circuit c3 0.1uf c4 10uf vdd18v vdda PAH8011ET-IP vddled2 18 vssled 7 vddio 3 led2 19 vddled01 9 led1 20 powerdn 15 spi_sdo 16 vdday 6 spi_sdi_i2c_sda 2 led0 21 spi_sclk_i2c_scl 1 spi_csn 17 int1 4 int2 14 vssd 12 vssa 5 spi_i2c 13 vddd 11 vddm 8 vdda 10 c1 0.1uf c2 10uf r1 0 vddm spi_sdo spi_csn vssd spi_i2c int2 powerdn vdd_led2 spi_sclk_i2c_scl spi_sdi_i2c_sda vddio int1 vdday vssa vssled vddm vdd_led01 c5 0.1uf c6 10uf vddled dgnd dgnd 1: spi 0: i2c agnd agnd c10 0.1uf c9 0.1uf dgnd ledgnd c7 0.1uf agnd host interface: 3.1 - 3.6v (vddm) 3.3 - 4.5v (vddled) 1.7 - 1.9v (vdd18v) vddio (1.8 - 3.3v) gnd spi_sclk_i2c_scl spi_sdi_i2c_sda int1 int2 powerdn layout note: 1. c7, c8, c9, c10 capacitor close to package 2. agnd, dgnd, ledgnd separate and connect to pcb main ground led2 led1 PAH8011ET-IP ggir package led0 r3 0 c8 0.1uf agnd r2 0 vddd spi_sdo dgnd spi_csn for i2c interface only
15 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.4 design guidelines 4.4.1 schematic design 1. vddm & vddio & vddled: 3.3v, vdd18v: 1.8v (for 3.3v system) 2. vddm & vddled: 3.3v~3.6v, vddio & vdd18v: 1.8v (for 1.8v system) 3. vddm & vddled: 3.3v~3.6v, vdd18v: 1.8v, vddio: 2.8v (for 2.8v system) 4. it is recommended to separate the power system of vddm/vddled and wireless system to avoid power interference. 5. the maximum load current of ldo (supplying power to vddm/vdd18v/vddled/vddio) need to be larger than 250ma. for maximum current of each power rail, refer to iddm_max, iddled_max, iddd_max, idda_max, iddio_max and idday_max parameters in table 6. dc electrical specifications . 6. spi_sdi_i2c_sda and spi_sclk_i2c_scl pull high to vddio with resistor for i 2 c only. 7. spi_sdo and spi_csn pull down to gnd for i2c only. 8. spi_sdi_i2c_sda weakly pull high to vddio with resistor for spi only when host is input mode at no io toggle state. 9. vddm, vddd, vdda, vdday must have 0.1f capacitor connecting to gnd and place closely to 8011. 10. the agnd, dgnd and ledgnd must be separated and connected to pcb main gnd. 11. int1 pin is recommended to be connected to mcu hw int as data ready int for power saving. 12. int2 pin is recommended to be connected to mcu hw int for touch function. 13. ensure that the vddm, vddled, vdd18vs power noise should be under 100mv. (with 0.1f and 10f capacitor) 14. tie spi_i2c pin to vddio for spi or tie to gnd for i 2 c. 15. at power on, v ddio must be powered on equal to or first than vdd18v. note: when vddio must be powered on first before vddm, host should prevent using the i2c interface (connected with chip ) to switch the ldo providing vddm voltage. 16. at power o ff for 1.8v io system , vddm must be powered off first than vdd18v/vddio. 17. at power off for 2.8v/3.3v io system , vddio and vddm must be powered off first than vdd18v. 18. when 8011e t is not in use, entering power down mode. 4.4.2 recommend ed pcb layout 4.4.2.1 pad dimension on pcb/fpc 1. pad size design: ? if use solder mask defined (smd), pad size is referred as solder mask opening size. ? if use non - solder mask defined (non - smd), pad size is referred as copper metal size. 2. recommended dimension of pad is shown in figure 8 . the actual pad size design will need to consider components aside. (all dimension are mm) figure 8 . recommend ed pcb layout
16 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.4.2.2 if us ing fpc ( flex ) board, stiffener is required to be added on the back of fpc (flex) (at the other side of chip package area) to enhance the flex strength. ? recommended stiffener type: fr4 or stainless steel. ? recommended stiffener thickness: minimum 0.4mm for fr4 type, minimum 0.15mm for stainless steel. 4.4.2.3 recommended use of 0.1~0.12 mm thickness stencil for smt process ? the stencil thickness selection will need to consider passive component size aside package. ? in case of the package is surface mounted on fpcb (flexible printed circuit boards), the overall thickness of cover layer & adh esive layer is recommenced to be controlled under than 40 m. 4.4.3 pcb layout guidelines the following guidelines can be refer to figure 9 . 1. trace width of vddm , vddio , vdd led, vdda, vddd , vdday traces must be at least 8 mil s . 2. capacitor 0.1f must be placed close to the chip package. 3. the gnd plane of gnd of vssa, vssd and vssled must be layout separately and connected to the pcbs main gnd. 4. if use fpc (flex) board, recommend vssled pin separately to output pin, because of high led current operation. figure 9 . pcb layout guide
17 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.5 recommend guideline for pcb assembly recommended pb - free solder paste vender and type : ? almit lfm - 48w tm - hp ? senju m705 - grn360 - k ir reflow soldering profile can be refer red to figure 10 . temperature profile is the most important control in reflow soldering. it must be fine - tuned to establish a robust process. the typical recommended ir reflow profile is: figure 10 . i r reflow soldering profile note: (1) average ramp - up rate (30 to preheat zone): 1.5~2.5 /sec (2) preheat zone: (2.1) temperature ramp from 170~200 (2.2) exposure time: 90 +/ - 30 sec (3) melting zone: (3.1) melting area temperature > 220 for at least 30~50sec (3.2) peak temperature: 245 ms level: ms level 3
18 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.6 packag ing information 4.6.1 carrier drawing figure 11 . carrier drawing
19 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 4.6.2 unit orientation figure 12 . unit orientation the maximum capacity of one packing box: one inner packing box = 2500 units note: the tape and reel packing with vacuum pack is 1year storage available @ 25 c , 50%rh
20 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. 5.0 registers list table 7 . register bank0 note: switch to register ba nk0 by writing 0x00 to reg - 0x7f address register name access default address register name access default 0x00 product_id_lb ro 0x11 0x41 ae_chb_innerhitarget_lb r/w 0x00 0x01 product_id_hb ro 0x80 0x42 ae_chb_innerhitarget_hb r/w 0x09 0x02 version_id ro 0x b 1 0x43 ae_chb_innerlotarget_lb r/w 0x00 0x13 ae_cha_enh r/w 0x03 0x44 ae_chb_innerlotarget_hb r/w 0x07 0x14 ae_cha_item r/w 0x 1 b 0x49 ae_chb_led_dac_max r/w 0x3f 0x16 ae_cha_et_max_lb r/w 0x a0 0x4a ae_chb_led_dac_min r/w 0x01 0x17 ae_cha_et_max_hb r/w 0x00 0 x 51 ae_chc_enh r/w 0x03 0x19 ae_cha_et_min_lb r/w 0x20 0x52 ae_chc_item r/w 0x1 b 0x1a ae_cha_et_min_hb r/w 0x00 0x54 ae_c hc_et_max_lb r/w 0xa0 0x1d ae_cha_et_step r/w 0x08 0x55 ae_chc_et_max_hb r/w 0x00 0x1e ae_cha_outerhibound_lb r/w 0x00 0x57 ae_chc_et_min_lb r/w 0x20 0x1f ae_cha_outerhibound_hb r/w 0x 0a 0x58 ae_chc_et_min_hb r/w 0x00 0x20 ae_cha_outerlobound_lb r/w 0x 00 0x5b ae_chc_et_step r/w 0x08 0x21 ae_cha_outerlobound_hb r/w 0x06 0x5c ae_chc_outerhibound_lb r/w 0x00 0x22 ae_cha_innerhitarget_lb r/w 0x00 0x5d ae_chc_outerhibound_hb r/w 0x 0a 0x23 ae_cha_innerhitarget_hb r/w 0x09 0x5e ae_chc_outerlobound_lb r/w 0x 00 0x24 ae_cha_innerlotarget_lb r/w 0x00 0x5f ae_chc_outerlobound_hb r/w 0x06 0x25 ae_cha_innerlotarget_hb r/w 0x07 0x60 ae_chc_innerhitarget_lb r/w 0x00 0x2 a ae_cha_led_dac_max r/w 0x 3f 0x61 ae_chc_innerhitarget_hb r/w 0x09 0x2b ae_cha_led_dac_min r/w 0x01 0x62 ae_chc_innerlotarget_lb r/w 0x00 0x32 ae_chb_enh r/w 0x03 0x63 ae_chc_innerlotarget_hb r/w 0x07 0x33 ae_chb_item r/w 0x1 b 0x68 ae_chc_led_dac_max r/w 0x3f 0x35 ae_chb_et_max_lb r/w 0xa0 0x69 ae_chc_led_dac_min r/w 0x01 0x36 ae_chb_et_max_hb r/w 0x00 0x70 c h a_led _assign r/w 0x01 0x38 ae_chb_et_min_lb r/w 0x20 0x71 ch b _led _assign r/w 0x02 0x39 ae_chb_et_min_hb r/w 0x00 0x72 chc_led _assign r/w 0x04 0x3c ae_chb_et_step r/w 0x08 0x73 cha_ pixel_assign r/w 0x0f 0x3d ae_chb_outerhibound_lb r/w 0x 00 0x74 ch b _ pixel_assign r/w 0x0f 0x3e ae_chb_outerhibound_hb r/w 0x 0a 0x75 chc_ pixel_assign r/w 0x0f 0x3f ae_chb_outerlobound_lb r/w 0x00 0x40 ae_chb_outerlobound_hb r/w 0x06
21 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. table 8 . register bank1 note: switch to register ba nk1 by writing 0x01 to reg - 0x7f address register name access default address register name access default 0x00 cht _touch_function r/w 0x03 0x2b cha_adc_samp_n um r/w 0x02 0x02 cht_e xpotime r/w 0x28 0x2c ch b _adc_samp_n um r/w 0x02 0x03 cht_ledda c r/w 0x50 0x2d chc_adc_samp_n um r/w 0x02 0x04 touch_upperth_lb r/w 0x00 0x2e adc_ normalized _enl r/w 0x00 0x05 touch_upperth_hb r/w 0x07 0x2f wr_data_trun cate r/w 0x0a 0x0 7 touch_lowerth_lb r/w 0x00 0x30 tg_enable r/w 0x00 0x0 8 touch_lowerth_hb r/w 0x0 6 0x35 int _type r/w 0x3e 0x0a touch_count_th r/w 0x01 0x36 int_ mode_sel r/w 0x0e 0x0b notouch_count_th r/w 0x00 0x37 int_mask_select r/w 0x00 0x0d c h t_led _assign r/w 0x01 0x38 cha_auto_frame period_enh r/w 0x0 1 0x0e cht_ pixel_assign r/w 0x 10 0x3c cha_au to_fp_max_lb r/w 0x8 0 0x11 cht_frame_ period r/w 0x0a 0x3d cha_auto_fp_max_hb r/w 0 x0 2 0x12 cht_report_d ivider_lb r/w 0x14 0x3 e cha_auto_fp_min _lb r/w 0x14 0x13 cht_report_d ivider_hb r/w 0x00 0x3 f cha_auto_fp_min _hb r/w 0 x00 0x14 cht_adc_samp_n um r/w 0x03 0x40 ch b _auto_frame period_enh r/w 0x01 0x15 ch a _frame_ period_lb r/w 0x28 0x44 chb_auto_fp_max_lb r/w 0x80 0x16 ch a _frame_ period_hb r/w 0x00 0x45 chb_auto_fp_max_hb r/w 0 x02 0x17 ch b _frame_ period_lb r/w 0x28 0x46 chb_auto_fp_min _lb r/w 0x14 0x18 c h b _frame_ period_hb r/w 0x00 0x47 chb_auto_fp_min _hb r/w 0 x00 0x19 ch c _frame_ period_lb r/w 0x28 0x48 ch c _auto_frame period_enh r/w 0x01 0x1a ch c _frame_ period_hb r/w 0x00 0x4c chc_auto_fp_max_lb r/w 0x 80 0x1b ch a _ frame_ samp_num r/w 0x04 0x4d chc_auto_fp_m ax_hb r/w 0 x02 0x1 c ch b _ frame_ samp_num r/w 0x04 0x4e chc_auto_fp_min _lb r/w 0x14 0x1d ch c _ frame_ samp_num r/w 0x04 0x4f chc_auto_fp_min _hb r/w 0 x00 0x21 cha_ function r/w 0x68 0x56 fifo_rptnum_lb r/w 0x29 0x2 3 chb_ function r/w 0x69 0x57 fifo_rptnum_hb r/w 0x00 0x2 4 u pdate_flag r/w 0x00 0x58 fifo_autoclearnum r/w 0x14 0x2 5 chc_ function r/w 0x69 0x5a fifo_data_mode r/w 0x03 0x26 golden_report_di vider_lb r/w 0x40 0x5b fifo _info _mode r/w 0x00 0x27 golden_report_di vider_hb r/w 0x0 6 0x5d led 0 dac_ man_code r/w 0x40 0x28 ch a _report_d ivider r/w 0x01 0x5e led 1 dac_ man_code r/w 0x40 0x29 chb_report_d ivider r/w 0x01 0x5f led 2 dac_ man_code r/w 0x40 0x2a chc_report_d ivider r/w 0x01 0x60 leddac_test_enh r/w 0 x00
22 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. table 9 . register bank2 n ote: switch to register ba nk2 by writing 0x02 to reg - 0x7f address register name access default address register name access default 0x00 read_touch_data_lb ro 0x00 0x16 read_cha_adc_data _hb ro 0x00 0x01 read_touch_data_hb ro 0x00 0x17 read_ch b _adc_data _l b ro 0x00 0x 0 3 read_cha_e t_lb ro 0x00 0x18 read_chb_adc_data _hb ro 0x00 0x04 read_cha_e t_hb ro 0x00 0x19 read_chc_adc_data _lb ro 0x00 0x06 read_chb_e t_lb ro 0x00 0x1a read_chc_adc_data _hb ro 0x00 0x07 read_chb_e t_hb ro 0x00 0x1b int_reg_array r/w 0x00 0x09 read_ch c _e t_lb ro 0x00 0x1c read_fifo_checksum_a ro 0x00 0x0a read_chc_e t_hb ro 0x00 0x1d read_fifo_checksum_b ro 0x00 0x0c read_cha_leddac ro 0x00 0x1 e read_fifo_checksum_c ro 0x00 0x0d read_ch b _leddac ro 0x00 0x1f read_fifo_checksum_d ro 0x00 0 x0e read_chc_leddac ro 0x00 0x20 read_fifo_checksum_e ro 0x00 0x0f read_cha_fp_lb ro 0x00 0x25 fifo_rptnum_sync _lb ro 0x00 0x10 read_cha_fp_hb ro 0x00 0x26 fifo_rptnum_sync _hb ro 0x00 0x11 read_chb_fp_lb ro 0x00 0x4b timestamp_enh r/w 0x00 0x12 read_ch b_fp_hb ro 0x00 0x4e timestamp_data_a ro 0x00 0x13 read_ch c _fp_lb ro 0x00 0x4f timestamp_data_ b ro 0x00 0x14 read_chc_fp_hb ro 0x00 0x50 timestamp_data_ c ro 0x00 0x15 read_cha_adc_data _lb ro 0x00 register bank 3 are fifo data, use interface to burst read address 0x00 for acquiring fifo data. note: switch to register ba nk 3 by writing 0x0 3 to reg - 0x7f table 10 . register bank 4 note: switch to register ba nk 4 by writing 0x0 4 to reg - 0x7f address register name access default 0x15 int_direction r/w 0x0f 0x64 global_reset_n r/w 0x01 0x65 tg_reset_n r/w 0x01 0x66 reg_reset_ n r/w 0x01 0x69 pd _mode_enh r/w 0x00
23 pixart imaging inc. pah8011et product datasheet low power heart rate monitor optical chip version 1.1 | 22 sep. 2017 | 31009 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission. document revision history r evision number date description 1.0 30 j un 2017 p roduct release version 1 .1 2 2 sep 2017 1. update unit orientation figure 2. m odify recommended layout pcb

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